About Avantpac

Overview

Established in 2005, Avantpac Technology is located in the Kaohsiung Export Processing Zone. We specialize in packaging for wire bonding, image sensors, opto-semiconductors, gas sensors, and related MEMS (Micro-Electro-Mechanical Systems) integrated circuits. Our services include providing customers with rapid and diverse engineering samples, as well as product, structural, and process design and optimization.

Mission

Avantpac Technology is dedicated to providing customers with solutions for IC packaging processes, including process design, improvement, optimization, and related material applications. We assist our clients in enhancing yield rates, increasing production capacity, and meeting the rapidly changing demands of the market.

 

Culture & Advantage

Avantpac team is composed of professionals with expertise in IC packaging processes, design, jigs/fixtures, materials, and development, each possessing over 20 to 30 years of relevant industry and technical experience. With a comprehensive understanding of process and design requirements, we can quickly and thoroughly grasp customer needs, enhance communication effectiveness, and swiftly and accurately deliver on requirements and provide effective solutions.