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  MEMS Pressure MEMS Microphone
 
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  Technology Papers
  1. A Tiny Plastic Package of Piezoresistive Pressure Sensors Constructed by Sacrifice-Replacement Approach.
   Electronic Components and Technology Conference.(2008)
  2. Hygroscopic Swelling Effect on Polymeric Materials and Thermo-hygro-mechanical Design on Finger Printer
   Package. (2008)
  3. 指紋辨識器濕-熱-結構耦合分析. The 33rd National Conference on Theoretical and Applied Mechanics.
   (November 13-14, 2009)
  4. 金線與銅線的材料特性及其銲線製程之動態分析(一)材料特性分析. The 33rd National Conference on Theoretical
   and Applied Mechanics. (November 13-14, 2009)